Gel flux is the condensed rosin type flux of RMA class, intended for SMT assembly and repairs. Gel flux can be applied through a sieve, pattern or from a syringe. Activators utilized in flux manufacturing process enable to leave its remnants after soldering on the package (as far as the process does not include washing phases).
Good solderability on the following surfaces: Ag, Cu, Au, Zn, Cd, SnPb.